Microsemi Corporation APTM100A23ST Mfr Package Description: MODULE-10 Package Shape: RECTANGULAR Package Style: FLANGE MOUNT Terminal Form: UNSPECIFIED Terminal Finish: TIN LEAD Terminal Position: UPPER Number of Terminals: 10 Package Body Material: UNSPECIFIED Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR Case Connection: ISOLATED Number of Elements: 2 Transistor Application: SWITCHING Transistor Element Material: SILICON Channel Type: N-CHANNEL FET Technology: METAL-OXIDE SEMICONDUCTOR Operating Mode: ENHANCEMENT Transistor Type: GENERAL PURPOSE POWER Drain Current-Max (ID): 36 A DS Breakdown Voltage-Min: 1000 V Avalanche Energy Rating (Eas): 2500 mJ Drain-source On Resistance-Max: 0.2300 ohm Pulsed Drain Current-Max (IDM): 144 A